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Layer and Material Analysis

Internal and external interfaces and peripheral areas have an important role in microsystems technology, as well as in many other areas of technology. For product development, trouble shooting, process and quality assurance or the optimization of technological processes, modern methods of instrumental surface and layer analysis have thus become indispensable tools.

X-ray fluorescence analysis (XRF) has long been utilized to characterize layers. Several layers can be measured at the same time, e.g. solder on nickel-plated copper alloys.
Whether there are functional or decorative layers, the RFA became generally accepted as an efficient measuring method in the process measuring technique and also in the research lab.

For the analysis of coatings with regard to layer thickness, roughness, topology and chemical composition, Corporate Technology Services draw on state-of-the-art analysis equipment of the surface spectroscopy, the optical microscopy and the X-ray reflectometry.