MID - Construction and Connection Technology

Soldering or conductive gluing are employed in SMD (Surface Mounted Device) packaging.

The preferred method for MIDs (Molded Interconnect Devices) is vapour phase soldering. This method achieves a homogenous temperature distribution on the assembly, as in connection with three-dimensional geometric shapes.

As an alternative connection technology we use conductive gluing. In particular, it is utilized as an alternative in materials that are not suitable for soldering or when an assembly hierarchy is required.

Thanks to the scope of 3D-MID design freedom a variety of connections can be integrated. This is achieved by pressing pins into the plastic part, whereby the pins allow standard connectors to be used to connect the MID components.

3D-MID components can be packaged on the PCB in a manner comparable to that for SMD components. PCBs can also be integrated into 3D-MID systems. An expedient combination makes the best possible use of the strengths of the two technologies in the overall system.

When combined with integrated silicon chips, 3D-MID components offer attractive miniaturization potential. HARTING Mitronics has qualified two assembly strategies in order to utilize these possibilities as effectively as possible.

Wire bonding
In wire bonding the silicon chip is fixed in place on the assembly with adhesives. Subsequently, the chip's contacts are connected to the conductor paths with wire and protected against ambient factors by means of a potting compound made of epoxy resin (Glob Top).

Flip chip
In the flip chip process, the silicon chip is placed on the conductor path in an inverted position as a matter of principle. The electrical contacting, mechanical fixation and protection of the chip surface are then handled in a single process step.