Products & Solutions
MID - Construction and Connection Technology
From the component to your 3D system
The connection technology is chosen on the basis of the product design. We cooperate closely with you in deciding on the ideal solution for your product.
Learn more about the different connection technologies
Soldering or conductive gluing are employed in SMD (Surface Mounted Device) packaging.
The preferred method for MIDs (Molded Interconnect Devices) is vapour phase soldering. This method achieves a homogenous temperature distribution on the assembly, as in connection with three-dimensional geometric shapes.
As an alternative connection technology we use conductive gluing. In particular, it is utilized as an alternative in materials that are not suitable for soldering or when an assembly hierarchy is required.
MID and connector
MID and PCB
When combined with integrated silicon chips, 3D-MID components offer attractive miniaturization potential. HARTING Mitronics has qualified two assembly strategies in order to utilize these possibilities as effectively as possible.
In wire bonding the silicon chip is fixed in place on the assembly with adhesives. Subsequently, the chip's contacts are connected to the conductor paths with wire and protected against ambient factors by means of a potting compound made of epoxy resin (Glob Top).
In the flip chip process, the silicon chip is placed on the conductor path in an inverted position as a matter of principle. The electrical contacting, mechanical fixation and protection of the chip surface are then handled in a single process step.