Live-Webinar
CONNECTIVITY TRENDS IN SEMICONDUCTOR: MODULARITY, IIOT, AND MINIATURIZATION
LIVE-WEBINAR ON SEPTEMBER 10, 2020
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A fundamental shift is happening in Semiconductor tool architecture. Minimization of size and downtime are critical components to successful tool design. Unique and space saving solutions which allow for reduction in panel size, less cabling, easier maintenance, and EMC protection decreases failure points, while predictive maintenance through electrical system monitoring will foresee component breakdown before it’s too late.
Join our webinar to learn:
- How cutting-edge connectors help build advanced Power, Signal, and Data communications in Semiconductor
- How connector modularization can enhance “cell” design
- How to reduce cabling and more than double your ethernet connections per board / device
- The future of SMART manufacturing, new sensors, and AI/ML featuring Dr. Vivek Dave, MIT
Webinar details
- Language: English
- Date: September 10, 2020
- Start:
9 a.m. PST
11 a.m. CST
12 p.m. EST - Duration:
30 minutes
+ 15 minutes Q&A - After the webinar a recording will be available
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