har-flex HD-Card Edge 100p PL1 SAMPLE
Article No.: 15 04 100 2001 333
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har-flex HD-Card Edge 100p PL1 SAMPLE
Article No.: 15 04 100 2001 333
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Properties Overview
Product Details
Category | Connectors |
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Series | har-flex® |
Identification | HD-Card Edge |
Element | Connector |
Termination method | Reflow soldering termination (SMT) |
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Connection type | Motherboard to daughtercard |
Mezzanine | |
Number of contacts | 100 |
Pack contents | Sample |
Contact rows | 2 |
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Contact spacing (termination side) | 0.8 mm |
Contact spacing (mating side) | 0.8 mm |
Data rate | 25 Gbit/s |
Clearance distance | ≥0.2 mm Backplane |
≥0.53 mm Connector | |
≥0.1 mm Daughtercard | |
Creepage distance | ≥0.2 mm Backplane |
≥0.53 mm Connector | |
≥0.1 mm Daughtercard | |
Limiting temperature | -55 ... +125 °C |
Insertion force | ≤ 70 N |
Withdrawal force | ≥ 20 N |
Performance level | 1 |
Mating cycles | ≥ 200 |
Isolation group | IIIa (175 ≤ CTI < 400) |
Moisture Sensitivity Level (MSL) | 1 acc. to ECA/IPC/JEDEC J-STD-020D |
Process Sensitivity Level (PSL) | R0 acc. to ECA/IPC/JEDEC J-STD-020D |
Coplanarity of contacts | ≤ 0.13 mm |
Material (insert) | Liquid crystal polymer (LCP) |
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Colour (insert) | Black |
Material (contacts) | Copper alloy |
Surface (contacts) | Noble metal over Ni Mating side |
Sn over Ni Termination side | |
Material flammability class acc. to UL 94 | V-0 |
RoHS | compliant |
ELV status | compliant |
China RoHS | e |
REACH Annex XVII substances | Not contained |
REACH ANNEX XIV substances | Not contained |
REACH SVHC substances | Not contained |
California Proposition 65 substances | Not contained |
Packaging size | 1 |
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Country of origin | China |
European customs tariff number | 85366990 |
GTIN | 5713140205444 |
ETIM | EC002637 |
eCl@ss | 27460201 PCB connector (board connector) |
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