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| Version | ||
|---|---|---|
| Connection type | Motherboard to daughtercard|Mezzanine | Motherboard to daughtercard|Mezzanine |
| Number of contacts | 140 | 140 |
| Pack contents | 200 pieces on reel | Sample |
| Termination method | Reflow soldering termination (SMT) | Reflow soldering termination (SMT) |
| Technical characteristics | ||
| Coplanarity of contacts | ≤ 0.15 mm | ≤ 0.15 mm |
| Insertion force | ≤ 100 N | ≤ 100 N |
| Withdrawal force | ≥ 28 N | ≥ 28 N |
| Creepage distance | ≥0.2 mm Backplane|≥0.53 mm Connector|≥0.1 mm Daughtercard | ≥0.2 mm Backplane|≥0.53 mm Connector|≥0.1 mm Daughtercard |
| Performance level | 1 | 1 |
| Data rate | 25 Gbit/s | 25 Gbit/s |
| Contact rows | 2 | 2 |
| Contact spacing (mating side) | 0.8 mm | 0.8 mm |
| Mating cycles | ≥ 200 | ≥ 200 |
| Contact spacing (termination side) | 0.8 mm | 0.8 mm |
| Moisture Sensitivity Level (MSL) | 1 acc. to ECA/IPC/JEDEC J-STD-020D | 1 acc. to ECA/IPC/JEDEC J-STD-020D |
| Process Sensitivity Level (PSL) | R0 acc. to ECA/IPC/JEDEC J-STD-020D | R0 acc. to ECA/IPC/JEDEC J-STD-020D |
| Clearance distance | ≥0.2 mm Backplane|≥0.53 mm Connector|≥0.1 mm Daughtercard | ≥0.2 mm Backplane|≥0.53 mm Connector|≥0.1 mm Daughtercard |
| Limiting temperature | -55 ... +125 °C | -55 ... +125 °C |
| Isolation group | IIIa (175 ≤ CTI 400) | IIIa (175 ≤ CTI 400) |
| Links | ||
| Whitepaper | https://d33y5j6752j001.cloudfront.net/asset/201312468866/document_ifd9i1f1bd01t6mk6dr9s45u2u | https://d33y5j6752j001.cloudfront.net/asset/201312468866/document_ifd9i1f1bd01t6mk6dr9s45u2u |
| Identification | ||
| Identification | HD-Card Edge | HD-Card Edge |
| Category | Connectors | Connectors |
| Features | Termination method of hold downs: SMT | The sample packaging is not suitable for automated assembly. |
| Element | Connector | Connector |
| Series | har-flex@ | har-flex@ |
| Material properties | ||
| Material (insert) | Liquid crystal polymer (LCP) | Liquid crystal polymer (LCP) |
| Colour (insert) | Black | Black |
| China RoHS | e | e |
| ELV status | compliant | compliant |
| Material flammability class acc. to UL 94 | V-0 | V-0 |
| REACH ANNEX XIV substances | Not contained | Not contained |
| RoHS | compliant | compliant |
| REACH Annex XVII substances | Not contained | Not contained |
| California Proposition 65 substances | Not contained | Not contained |
| REACH SVHC substances | Not contained | Not contained |
| Surface (contacts) | Noble metal over Ni Mating side|Sn over Ni Termination side | Noble metal over Ni Mating side|Sn over Ni Termination side |
| Material (contacts) | Copper alloy | Copper alloy |
| Commercial data | ||
| eCl@ss | 27460201 PCB connector (board connector) | 27460201 PCB connector (board connector) |
| Net weight | 3.28 kg | 16.2 g |
| GTIN | 5713140205673 | 5713140205468 |
| ETIM | EC002637 | EC002637 |
| European customs tariff number | 85366990 | 85366990 |
| Country of origin | China | China |
| UNSPSC 24.0 | 39121415 | 39121415 |
| Packaging size | 1 | 1 |