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| Version | ||
|---|---|---|
| Contact configuration | Rows z, a, b, c, and d, positions 1, 2, ... , 31, 32 | Rows z, a, b, c, and d, positions 1, 2, ... , 31, 32 |
| Connection type | Motherboard to daughtercard|Extender card | Motherboard to daughtercard|Extender card |
| Leading contact on position | d1|d2|d31|d32 | d1|d2|d31|d32 |
| PCB fixing | With fixing flange|With snap-in clip | With fixing flange|With snap-in clip |
| Number of contacts | 160.0 | 160.0 |
| Termination method | Reflow soldering termination (THR)|Wave soldering termination | Reflow soldering termination (THR)|Wave soldering termination |
| Specifications and approvals | ||
| Specifications | IEC 61076-4-113 | IEC 61076-4-113 |
| Railway classification | F1/I2 acc. to NFF 16-101/102 | F1/I2 acc. to NFF 16-101/102 |
| UL / CSA | UL 1977 ECBT2.E102079|CSA-C22.2 No. 182.3 ECBT8.E102079 | UL 1977 ECBT2.E102079|CSA-C22.2 No. 182.3 ECBT8.E102079 |
| Technical characteristics | ||
| Rated current | Rated current measured at 20 °C, see derating curve for details | Rated current measured at 20 °C, see derating curve for details |
| Isolation group | IIIa (175 ≤ CTI < 400) | IIIa (175 ≤ CTI < 400) |
| Mating cycles | 500.0 | 250.0 |
| Clearance distance | 1.2 mm between 2 rows (a, b, c)|1.2 mm between 2 rows (z, d)|1.2 mm between 2 contacts in a row (a, b, c)|1 mm between 2 contacts in a row (z, d) | 1.2 mm between 2 rows (a, b, c)|1.2 mm between 2 rows (z, d)|1.2 mm between 2 contacts in a row (a, b, c)|1 mm between 2 contacts in a row (z, d) |
| Insulation resistance | >1010 Ω | >1010 Ω |
| Hot plugging | No | No |
| Performance level | AU 50|1|acc. to IEC 61076-4-113 | 2|acc. to IEC 61076-4-113 |
| Test voltage Ur.m.s. | 1 kV | 1 kV |
| PCB thickness | 1.6 mm ±0.2 | 1.6 mm ±0.2 |
| Withdrawal force | 120.0 | 120.0 |
| Insertion force | 160.0 | 160.0 |
| Contact spacing (mating side) | 2.54 | 2.54 |
| Contact rows | 5.0 | 5.0 |
| Creepage distance | 1.2 mm between 2 rows (a, b, c)|1.2 mm between 2 rows (z, d)|1.2 mm between 2 contacts in a row (a, b, c)|1 mm between 2 contacts in a row (z, d) | 1.2 mm between 2 rows (a, b, c)|1.2 mm between 2 rows (z, d)|1.2 mm between 2 contacts in a row (a, b, c)|1 mm between 2 contacts in a row (z, d) |
| Limiting temperature | -55 ... +125 °C (during reflow soldering max. +240 °C for 20 s) | -55 ... +125 °C (during reflow soldering max. +240 °C for 20 s) |
| Contact resistance | ≤20 mΩ for rows a, b, c|≤30 mΩ for rows z, d | ≤20 mΩ for rows a, b, c|≤30 mΩ for rows z, d |
| Contact spacing (termination side) | 2.54 | 2.54 |
| Identification | ||
| Description of the contact | Angled | Angled |
| Element | Male connector | Male connector |
| Category | Connectors | Connectors |
| Series | har-bus® 64 | har-bus® 64 |
| Features | Leaded tin on the solder termination | |
| Commercial data | ||
| Country of origin | Germany | Germany |
| European customs tariff number | 85366990 | 85366990 |
| ETIM | EC002637 | |
| UNSPSC 24.0 | 39121415 | 39121415 |
| Packaging size | 100.0 | 5.0 |
| Net weight | 17.55 kg | 2.0 kg |
| eCl@ss | 27460201 PCB connector (board connector) | 27460201 PCB connector (board connector) |
| GTIN | 5713140000063 | 5713140000094 |
| Material properties | ||
| REACH SVHC substances | Yes | Not contained |
| California Proposition 65 substances | Yes | Yes |
| REACH Annex XVII substances | Not contained | Not contained |
| Colour (insert) | Beige | Beige |
| Material (contacts) | Copper alloy | Copper alloy |
| RoHS | not compliant | compliant |
| Layer thickness | 1.27 µm | |
| China RoHS | e | |
| ELV status | not compliant | compliant |
| Surface (contacts) | Au over Ni Mating side|SnPb over Ni Termination side | Noble metal over Ni Mating side (Rows z and d)|Au over NiP over Ni Mating side (Rows a,b and c)|Sn over Ni Termination side |
| Material (insert) | Liquid crystal polymer (LCP) | Liquid crystal polymer (LCP) |
| REACH ANNEX XIV substances | Not contained | Not contained |
| Material flammability class acc. to UL 94 | V-0 | V-0 |